Hardware and firmware design

A complete service that follows the client from the feasibility study to the realisation of the circuit and board.

Hardware and firmware design CUBIT is able to manage all the Hardware & Firmware phases: from feasibility studies to defining design specifications, up to the realization of circuit schematics and card design. Thanks to the presence of a multidisciplinary staff, special attention is paid, from the early design phases, to emission issues and electromagnetic compatibility of the product. Moreover CUBIT is able to carry out the subsequent testing, essay and certification phase of cards in its laboratory and in the anechoic camera.

CUBIT has developed internally, on behalf of its members, a variety of contactless (RFID) and wireless (WiMAX, Bluetooth, WiFi) technologies, basing its policy on open architectures that allow real portability of applications and independence from suppliers. CUBIT offers both products and services developed upon customer specifications, “turnkey” integrated systems, highly innovative Design Consultancies. Find out more in the Solutions area.

Within wireless technologies – RFID, WiFi, Bluetooth, ZigBee and WiMAX – Hardware & Firmware design is included in two sectors of activity: Design and Development of radio frequency modules and Integration of radio frequency modules.

Design and Development of radio frequency modules

Hardware and firmware design CUBIT plans and develops modular solutions starting from the development of the PCB up to the realization of the Firmware. As well as feasibility tests, the phase of preliminary study includes the search of the components suitable for the realization of the project, keeping in mind their incidence on production costs. CUBIT deals with design of electronic diagram and the PCB layout following design rules allowing to avoid emission problems and electromagnetic compatibility. The prototype phase finally foresees the testing and card testing, the verification of the electromagnetic emissions and, where required, the UE certification.

Integration of radio frequency modules

The integration of radio frequency modules in complex systems is based on the development of complete Hardware and Software platforms integrating wireless modules on Linux and Windows embedded operating systems. The specific experience of CUBIT in wireless technologies – RFID, WiFi, Bluetooth, ZigBee and WiMAX – makes it possible to develop integrated systems which can be used inside embedded systems. Within the RFID, CUBIT is able to integrate HF and UHF modules in complex platforms assisting in using such technology within the new envisaged application scenarios: electronic payment, control access, monitoring of goods, just to mention some.

CUBIT relies on the presence of highly skilled companies in hardware systems based on radio technologies thus ensuring a rapid passage from design to prototype as well as large-scale production.


Hardware and firmware design CUBIT, thanks to its own SMT (Surface Mount Technology) production line, offers a service of prototypes and medium batches production of electronic boards. This production line consists in a Pick&Place machine, Full Convection Reflow Oven and semi-automatic stencil printer. It is possible to realize any kind of prototypes of electronic boards and to produce medium batches of the same.

Pick&Place – Specification
Board size
Max 350 x 450 mm
Min 10 x 10 mm
Speed of Placement
4500 cph
Placement precision
50 µm
Component types
Chip, Melf, SOT, SOIC, TSOP, TNT, PLCC, QFP, BGA, micro BGA, LCC and, in general, any components starting from the size of 0.5 x 1 mm 0402 Chip up to 50 x 50 mm.

Hardware and firmware design Reflow Oven – Specification
Tunnel Length
950 mm
Board Size
Max 400 mm
Lead Free
Heating System
Full convection circulated hot air from the top and support plates at the underside. 4 heating zones, 1 cool down zone
Infinite profiling possibilities are achieved in this reflow oven through 4 independently controlled heating zones, with bottom heating also adjustable to prevent overheating of inverted components on double-sided boards.


CUBIT. C​ubus project, co-financed under Tuscany POR FESR 2014-2020